Flip Chip Die Bonder at flip-chip-die-bonder.com

Flip Chip Die Bonder at flip-chip-die-bonder.com: Datacon is concentrating on Flip Chip Die Bonder solutions.

Datacon as a leading equipment supplier in the Flip Chip Die Bonder technology is offering you the ideal solution as well for your die attach applications as for your Flip Chip applications. Datacon Semiconductor Equipment GmbH has produced Flip Chip Die Bonder production equipment for the semiconductor industry since its incorporation in 1986. The successful introduction of a unique new machine platform concept to the European market in 1995 and to the American and Asian markets in 1998 has transformed Datacon into a global player in the semiconductor industry. Datacon pioneered the concept of modularity and flexibility for the Flip Chip Die Bonder equipment & die attach dispensing market. Since 1998 Datacon has been active worldwide.